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Hardening epoxy resin Product List

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[Newly Developed Product] One-component Heat-Curing Epoxy Resin TE-7901K

One-component × High thermal conductivity 6.5W/mK! Epoxy resin for heat dissipation insulation. Suitable for encapsulating components that require thermal management, such as motors and power devices.

TE-7901K is a one-component, heat-curing epoxy resin developed as an insulating material for heat dissipation in electronic and electrical equipment. It excels in workability due to the absence of a mixing process, allowing for stable quality during use. This product boasts a thermal conductivity of 6.5 W/m·K, making it suitable for heat dissipation measures in electronic components that generate heat, such as motors, coils, and power devices. Additionally, it has flame retardancy equivalent to UL94 V-0, making it a reliable choice for applications that require high reliability. 【Features】 - One-component, heat-curing epoxy resin (no mixing required, high workability) - High thermal conductivity: 6.5 W/m·K - Flame retardancy: UL94 V-0 equivalent (5mm thickness) - High insulation and high heat resistance (Tg 110℃) - Suitable for heat dissipation and insulation sealing applications in electronic devices *For more details, the product's specification sheet is available for download as a PDF below, or please contact us. *Samples are also available, so please reach out if needed.

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  • Hardening epoxy resin

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New Development Product: Two-Component Heat-Curing Epoxy Resin TE-7814V

High thermal conductivity of 2.5 W/mK and high Tg of 185°C, this is a highly reliable low-viscosity epoxy resin suitable for thermal management of motors and coils.

"TE-7814V" is a two-component, heat-curing epoxy resin suitable for heat dissipation sealing applications in electronic and electrical equipment. Its low viscosity design allows it to accommodate complex component shapes, significantly improving workability and production efficiency. This product has a thermal conductivity of 2.5 W/m·K, making it effective for heat dissipation measures in electronic components that generate heat. It can be widely used in fields that require high performance, such as electronic devices and power modules. 【Features】 - Two-component heat-curing epoxy resin (mixing ratio 100/100) - Suitable for complex component shapes due to low viscosity - High thermal conductivity: 2.5 W/m·K - High heat resistance: high Tg 185℃ - Flame retardant: equivalent to UL94 V-0 - High insulation properties ensure long-term reliability of electronic devices *For details, the product's specification sheet is available for download as a PDF from the link below, or please contact us. *Samples are also available, so please contact us if needed.

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[New Development] Two-component Heat-Curing Epoxy Resin TE-6409FR

Transparent, difficult to yellow, flame-retardant epoxy resin equivalent to V-0. Low viscosity with excellent workability. Widely usable from transparent sealing to clear panels.

"TE-6409FR" is a two-component transparent epoxy resin suitable for electronic component encapsulation and craft applications where transparency is required. The mixing ratio of the base agent to the hardener is 100:50, and the mixed viscosity is only 500 mPa·s, making it a low-viscosity design that allows for easy filling of details and uniform coating. It demonstrates over 90% transparency (420-600nm transmission) and is suitable for applications where appearance quality is important. Furthermore, it achieves excellent yellowing resistance, showing no discoloration even after a heat resistance test at 120°C for 1,000 hours, combining aesthetics with reliability. Additionally, it is flame-retardant, contributing to safety assurance. Applications include electronic component encapsulation, transparent panels, clear photo panels, and art crafts, making it versatile across various fields. 【Features】 ■ Two-component transparent epoxy resin (mixing ratio 100:50) ■ High transparency (over 90% transmission at 420-600nm) ■ Excellent workability with low viscosity of 500 mPa·s *For more details, the product specification sheet is available for download as a PDF below, or please contact us. *Samples are also available, so please reach out if needed.

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  • Other polymer materials
  • Hardening epoxy resin

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Newly Developed Product: Two-Component Heat-Curing Epoxy Resin TE-6000

Low viscosity for thorough filling of details! An epoxy resin that can also be considered as a varnish alternative. Cures at room temperature and contributes to energy savings.

The "TE-6000" is a low-viscosity, high-strength epoxy resin suitable for encapsulating electronic and electrical components. It is a two-component system with a mixing ratio of 100:30, making it easy to handle, and it has low-temperature curing properties, allowing it to cure at 70°C for 3 hours or at room temperature. Additionally, it enhances flexibility in the production process and contributes to energy savings. 【Features】 ■ Two-component heat-curing epoxy resin (mixing ratio 100:30) ■ Low viscosity with excellent filling properties and workability ■ Low-temperature curing (70°C for 3 hours, room temperature curing also possible) ■ High strength (flexural strength 110 MPa, elastic modulus 3,000 MPa) ■ High insulation properties (dielectric breakdown strength 30 kV/mm, volume resistivity 1×10^16 Ω·cm) *For more details, the product specification sheet is available for download as a PDF below, or please contact us. *Samples are also available, so please contact us if needed.

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[New Development] One-component Heat-Curing Epoxy Resin TE-5018

One-component × low-temperature curing × high insulation! Epoxy resin for encapsulating electronic components. Cures completely at 80°C in 1 hour! Low-temperature curing type enhances work efficiency.

TE-5018 is a one-component, heat-curing epoxy resin developed for bonding and insulating encapsulation applications of electronic and electrical components. While ensuring stability with refrigerated storage, it accommodates low-temperature curing at 80°C for 1 hour, making it suitable for heat-sensitive components and processes with temperature constraints. The cured material exhibits high mechanical strength with a bending strength of 95 MPa, a bending modulus of 3,300 MPa, and a Shore D hardness of 87. Additionally, it possesses excellent electrical properties with an insulation breakdown strength of 20 kV/mm and a volume resistivity of 5×10^15 Ω·cm, supporting the long-term reliability of electronic devices. Furthermore, it has balanced physical properties with a linear expansion coefficient of 61 ppm/K, a curing shrinkage rate of 2.5%, and a water absorption rate of 0.3%, reducing the risk of cracks and performance degradation. It also excels in workability and can be widely used for insulating encapsulation of electronic components, structural bonding, and ensuring reliability in heat and humidity-resistant environments. 【Features】 ■ One-component heat-curing epoxy resin (no mixing required) *For more details, the product's specification sheet is available for download as a PDF from the link below, or please contact us. *Samples are also available, so please inquire if needed.

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Two-component heat-curing epoxy resin for automotive use TE-7814V

High thermal conductivity 2.5 W/mK × high Tg 185°C high-reliability low-viscosity epoxy resin

In the automotive industry, reliable adhesion of components is essential to achieve both safety and durability. Particularly in areas exposed to high temperatures and vibrations, such as the engine compartment and vehicle structure, the performance of adhesives is crucial. Improper adhesion can lead to component detachment or performance degradation. TE-7814V offers high reliability in the adhesion of automotive parts, featuring high thermal conductivity and excellent heat resistance. 【Application Scenarios】 - Adhesion of engine components - Adhesion of vehicle structural components - Fixing of electronic components 【Benefits of Implementation】 - High adhesive strength - Excellent heat resistance - Assurance of long-term reliability

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Two-component heat-curing epoxy resin for electronic devices TE-7814V

High thermal conductivity 2.5W/mK × high Tg 185°C high-reliability low-viscosity epoxy resin

In the electronics industry, high insulation is required to ensure the long-term reliability of products. Particularly for electronic components exposed to temperature changes and vibrations, maintaining insulation performance is essential for preserving product performance. Inadequate insulation can lead to component failure or performance degradation. TE-7814V has high insulation properties, ensuring the long-term reliability of electronic devices. 【Usage Scenarios】 - Insulation of electronic devices - Insulation of power modules 【Benefits of Implementation】 - Improved long-term reliability of electronic devices - Maintenance of product performance - Reduced risk of component failure

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Two-component heat-curing epoxy resin for home appliances TE-7820FR3

High Tg and flame retardant to improve the safety of electrical appliances.

In the home appliance industry, the safety and reliability of products are of utmost importance. Especially for products used in high-temperature environments, flame-retardant materials are essential. In the event of a fire, it is necessary to prevent the spread of flames and protect consumer safety. The TE-7820FR3 is equipped with flame retardancy equivalent to UL94 V-0, enhancing the safety of home appliances. 【Application Scenarios】 - Power units - Motors - Heaters 【Benefits of Implementation】 - Improved safety due to high flame retardancy - Increased product reliability - Enhanced customer satisfaction

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[New Development] One-component Heat-Curing Epoxy Resin TE-5111K

This is a one-component heat-curing epoxy resin for new product development. It has a low curing shrinkage rate, a relatively high Tg point, and a fast curing time. [Properties table available]

TE-5111K is an epoxy resin with a low curing shrinkage rate, fast curing time, and a relatively high glass transition temperature of 168°C. It can be used for encapsulation of electrical and electronic components. Single-component heat-curing black epoxy resin Features: low coefficient of thermal expansion, low shrinkage, high workability (relatively low viscosity), high heat resistance, short curing time *For more details, we have published a product specification sheet, so please download the PDF from the link below or contact us. *Samples are also available, so please contact us if you need them.

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Newly Developed Product: Two-Component Heat-Curing Epoxy Resin TE-7820FR3

High Tg × Flame Retardant V-0 × Improved Copper Adhesion! Suitable for Power Device Encapsulation.

The "TE-7820FR3" is a two-component, heat-curing epoxy resin developed for power device encapsulation applications. With an easy-to-handle mixing ratio of 100/100, it achieves excellent filling properties due to its low viscosity and high workability. It features high heat resistance with a glass transition temperature of 174°C and flame retardancy equivalent to UL94 V-0 (2mm thickness). Additionally, it has been designed to improve adhesion to copper, enhancing the reliability of bonding with copper substrates and conductors. This makes it suitable for applications requiring thermal, electrical, and mechanical performance, such as semiconductor packages and power modules. 【Features】 ■ Two-component heat-curing epoxy resin (mixing ratio 100/100) ■ High strength and high heat resistance (Tg = 174°C) ■ Excellent thermal cycle resistance with a low coefficient of thermal expansion (20ppm/K) ■ Flame retardancy: UL94 V-0 equivalent (2mm thickness) ■ High insulation properties (dielectric breakdown strength over 25kV/mm, volume resistivity 4.0×10^16Ω·cm) *For more details, the product's specification sheet is available for download as a PDF below, or please contact us. *Samples are also available, so please contact us if needed.

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[Newly Developed Product] Two-Component Heat-Curing Epoxy Resin TE-7130

General-purpose epoxy resin for encapsulating electrical and electronic components. Suitable for encapsulating motors, coils, and more.

"TE-7130" is a general-purpose, two-component, heat-curing epoxy resin for the encapsulation of electrical and electronic components. With a mixing ratio of 100:20, it is easy to handle, and after curing, it becomes an encapsulant that combines high strength and high insulation properties. Its greatest feature is the realization of a low coefficient of linear expansion of 27 ppm/K. This reduces expansion and contraction due to temperature changes, thereby lowering the risk of crack formation. It is resistant to thermal cycling, ensuring long-term reliability for power devices and electronic components. [Features] - Two-component heat-curing epoxy resin (mixing ratio 100/20) - Low coefficient of linear expansion: 27 ppm/K → strong against thermal cycling, crack suppression - High insulation properties (dielectric breakdown strength 33 kV/mm, volume resistivity 1×10^16 Ω·cm) - High strength (flexural strength 141 MPa, flexural modulus 10,000 MPa) - Low water absorption rate of 0.1% ensures long-term stability *For more details, the product specification sheet is available for download as a PDF from the link below, or please contact us. *Samples are also available, so please contact us if needed.

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[New Development] Two-component Heat-Curing Epoxy Resin TE-7000

Fills in detail with low viscosity! A highly reliable epoxy resin that can also be considered as a varnish alternative. Flexible response to work plans with a usable time of 24 hours.

The "TE-7000" is a two-component, heat-curing epoxy resin suitable for sealing applications in electrical and electronic components. Its low viscosity design allows for excellent filling of details and can accommodate complex part shapes. This product has a long pot life of 24 hours (at 60°C), ensuring stable sealing operations while providing ample time for work processes. Additionally, it has a proven track record of passing high-temperature tests at 180 degrees and thermal tests at -40°C and 180°C. 【Features】 ■ Two-component heat-curing epoxy resin (mixing ratio 100:60) ■ Excellent filling properties and workability due to low viscosity ■ Long pot life of 24 hours (at 60°C) ■ High insulation properties (dielectric breakdown strength over 25kV/mm, volume resistivity > 1×10^16Ω·cm) ■ Flexural strength of 81MPa and flexural modulus of 2,400MPa ■ Low water absorption rate of 0.3% for improved reliability *For more details, the product's specification sheet is available for download as a PDF from the link below, or you can contact us for more information. *Samples are also available, so please contact us if needed.

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[Newly Developed Product] One-component Heat-Curing Epoxy Resin TE-5014K4

One-component × high strength × high thixotropy! An epoxy resin suitable for structural bonding. With a Tg of 130°C and a shear adhesive strength of 24 MPa, it is a highly reliable structural adhesive.

The "TE-5014K4" is a one-component, heat-curing epoxy resin developed for applications that require prevention of liquid dripping. It is easy to handle as no mixing is required. This product exhibits a shear adhesive strength of 24 MPa (SUS/SUS, 25°C). It shows a Shore D hardness of 85 and a volume resistivity of 1×10^15 Ω·cm or higher, designed to combine strength and insulation properties. The curing conditions are simple at 120°C for 2 hours, making it suitable for mass production processes. 【Features】 ■ One-component heat-curing epoxy resin ■ High heat resistance with Tg of 130°C ■ High strength adhesion (shear adhesive strength of 24 MPa) ■ High thixotropy for good workability ■ High hardness (Shore D 85), high insulation (volume resistivity > 1×10^15 Ω·cm) *For more details, the product's characteristic table is available, and you can download the PDF from below or contact us. *Samples are also available, so please contact us if needed.

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Single-component heat-curing epoxy resin for home appliances TE-7901K

One-liquid type × high thermal conductivity! Contributes to improving the durability of home appliances.

In the home appliance industry, long-term reliability and safety of products are required. Particularly for appliances exposed to temperature changes and vibrations, the protection of internal components and heat dissipation measures are crucial factors that influence the durability of the product. Inadequate heat dissipation can lead to component failure or performance degradation, potentially shortening the product's lifespan. The TE-7901K achieves a balance of high thermal conductivity and insulation, contributing to the durability of home appliances. 【Application Scenarios】 - Motors - Power devices - Coils 【Benefits of Implementation】 - Extended product lifespan due to improved heat dissipation - Enhanced safety through flame retardancy equivalent to UL94 V-0 - Improved workability due to one-component formulation

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